ORLANDO, FL — Working at the CHEP Innovation Center here is like being inside an episode of TV’s MythBusters with real-world applications — stuff gets broken, things get rough, but progress is made in helping design produce package that can withstand real-world conditions.
From temperature extremes to road vibrations and warehouse impacts, the facility helps cuts years off the curve when it comes to developing new and better ways to ship produce and other packaged goods.
We spent a day at the Center — and actually put in some work! — for a feature that first appeared on RFD-TV’s Market Day Report. Look for bonus footage in this version!